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September 17, 2026Proceedings of the Institution of Mechanical Engineers Part L Journal of Materials Design and Applications

Direction-dependent magnetic control of nickel microelectroforming: Deposition uniformity, residual stress and micropillar mold fabrication

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Authors

CCChen ChenJLJingang LiuKSKui Song

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Overview

Experimental study demonstrates magnetic field magnitude and angle modulate residual stress and deposition uniformity in nickel microelectroforming, suggesting viable control for precision mold...

Key Points

  • To determine how low-intensity magnetic field magnitude, orientation, and transport forces influence thickness uniformity, residual stress, and microstructural quality in nickel microelectroforming.
  • Varied magnetic flux density (0, 5, 10 mT), field orientation angle, stirring rate (400, 500 rpm), and cycle-averaged current alongside reduced-domain Lorentz-force mass transfer modeling.
  • Integrated magnetic control with pulse-reverse current and an auxiliary cathode to fabricate a nickel micropillar mold, followed by pull-off adhesion testing (n = 3).
  • Residual stress exhibited a non-monotonic response to magnetic flux density, measuring 217.7 ± 16.6 MPa at 0 mT, rising to 317.0 ± 13.6 MPa at 5 mT, and falling to 191.6 ± 18.9 MPa at 10 mT.
  • Field rotation redistributed thickness gradients rather than eliminating them, yielding the poorest overall surface, diffraction, and stress metrics at 60°, with a trade-off between stress and uniformity observed between 400 and 500 rpm at 10 mT and 90°.
  • The integrated fabrication approach achieved a micropillar mold with 14.7% height nonuniformity (1.40 μm range) and an adhesive-limited mean pull-off stress of 2.07 ± 0.11 MPa.

Cite This Study

Chen et al. (2026) studied this question.

synapsesocial.com/papers/6aabb68c5f706d05830e5034https://doi.org/10.1177/14644207261487179
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