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Better than Elmer's glue: Three necessary conditions for enhancement of solid interfacial interactions guide materials design to create strong, stable composites for interfacial adhesion. Ab initio molecular dynamics simulations were used to study copper adhesion on TaN(111) surfaces with a variety of intervening metals to enhance adhesion (see picture). The predicted adhesion phenomena agree well with experimental observations.
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Han et al. (2009) studied this question.
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