Materials study demonstrates thermally reversible Diels-Alder silicone cross-linking for device packaging, indicating a viable pathway for nondestructive component debonding.
When designing a consumer device, recyclability is not usually a primary consideration. Thus, packaging and encapsulation of interior and exterior components is achieved using robust materials─e.g., metals, glasses, ceramics, and adhesives bearing irreversible cross-links. If recycling is attempted, the high value components are most often liberated by incineration or destructive mechanical processing. Controlled debonding using a reversible adhesive is an approach to circumvent some of this destruction. This paper describes a reversibly cross-linked interlayer polymer (“ReCLIP”) that cures by way of a thermally reversible Diels–Alder (DA) reaction between furan-functionalized silicone chains and an aromatic bismaleimide. Two-dimensional 1 H– 1 H COSY NMR experiments were used to distinguish between the exo and endo diastereomers of the furan–maleimide DA adduct. The exo–endo ratio exerted a pronounced influence on the thermal stability and adhesion strength of the resulting polymer network. With one-dimensional 1 H NMR monitoring, we established that the Diels–Alder cross-linking proceeded most rapidly at 80 °C, while complete conversion and a high proportion of the exo adduct (∼93%) were also observed at 60 °C with extended reaction times. One-dimensional 1 H NMR also revealed that the onset of the reverse (retro-Diels–Alder) reaction occurred at ∼90 °C. Using a lap-shear geometry, ReCLIP exhibited a maximum shear strength of 286 ± 50 kPa, comparable in magnitude to values seen for other silicone adhesives. Films exhibited excellent transparency and stability over time under ambient conditions.
No takes yet. Share an insight, caveat, or question.
Moreau et al. (2025) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: