With the commercial availability of GaN and SiCbased power semiconductor devices having significantly improved material characteristics, there is a need to discuss the perspective of the underlying physical loss mechanisms of these devices versus their silicon counterparts. This article will compare latest generation Superjunction power transistors versus e-mode GaN HEMTs and SiC MOSFETs in terms of semiconductor losses and their potential for further improvement. A short application section will give practical information on best matching circuits for each device concept.
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