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This letter develops a simplified circuit model for the shielded differential through-silicon vias (SD-TSVs). The model is consisted of four frequency-independent elements and can accurately predict the insertion loss of the SD-TSVs up to 20 GHz. Based on the model, a parallel resistor-capacitor equalizer is proposed. The proposed passive equalizer achieves wide-band equalization and perfect compensation for high-speed differential signaling.
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Fu et al. (2018) studied this question.
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