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A novel π-complexation adsorbent is fabricated by grafting Cu(I)-containing molecule precursors onto β-cyclodextrin. The adsorbent provides a molecular-level dispersion of Cu(I), which is particularly beneficial to the adsorptive removal of aromatic sulfur thiophene, and is impossible to be realized through the conventional thermal method.
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Song et al. (2010) studied this question.
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