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January 1, 1994IEEE Transactions on Components Packaging and Manufacturing Technology Part B

The importance of material selection for flip chip on board assemblies

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Authors

GOGrace O’MalleyRoyal College of Surgeons in IrelandJGJ. GieslerMotorola (United States)SMS. MachugaMotorola (United States)

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Cite This Study

O’Malley et al. (1994) studied this question.

synapsesocial.com/papers/6ab0d1978c9cf29202ff679ahttps://doi.org/10.1109/96.311770
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Also Consider

Synapse has enriched 2 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Geometric Optimization of Controlled Collapse Interconnections1969 · 175 citations
  2. 2Mechanical Behavior of Flip-Chip Encapsulants1990 · 29 citations