Replicative generation of metal microstructures by template-directed electrometallization

Copper structures were produced by electrochemical deposition onto patterned self-assembled monolayers (SAMS) of thiols adsorbed on polycrystalline gold substrates and subsequent transfer to an insulating substrate. Selective metal deposition was achieved by use of thiols which differ in their electrochemical blocking properties, namely hexadecane thiol [CH3(CH2)15SH] and ω-(4′-methyl-biphenyl-4-yl)-methanethiol (CH3–C6H4–C6H4–CH2–SH). Besides control of the blocking properties, the SAM served to minimize adhesion between the metal deposit and the substrate, thus, allowing the transfer of the metal pattern. Since the process is replicative, it represents a very simple and fast route to generating metal patterns.