This paper reports a low-cost, excellent cross-talk isolation power integrated circuit (PIG) technology capable of integrating high-voltage LDMOS, high-voltage LIGBT, and low-voltage CMOS control circuit. The technology is implemented using a conventional twin-well CMOS process with no compromise on the CMOS devices, and the breakdown voltages of the LDMOS and LIGBT with drift length of 40 μm are over 400 V. Using this technology, operating current of the body diode of the LDMOS can be improved by over 16 times and operating current of the LIGBT can be improved by over five times before CMOS latch-up in the control circuit occurs.
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Chan et al. (1996) studied this question.
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