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Au Bump Interconnection in 20 µm Pitch on 3D Chip Stacking Technology, Tanida, Kazumasa, Umemoto, Mitsuo, Morifuji, Tadahiro, Kajiwara, Ryoichi, Ando, Tatsuya, Tomita, Yoshihiro, Tanaka, Naotaka, Takahashi, Kenji
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Tanida et al. (2003) studied this question.
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