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A new fluoro‐containing four‐arm organosiloxane has been successfully synthesized, which can be easily converted to a cross‐linked network, showing water uptake of below 0.12 wt% (maintained in boiling water for 72 h) and dielectric constant of below 2.56 with dissipation factor of near 1.8 × 10−3 at 30 MHz, as well as showing high transparency and good thermostability. These data indicate that this new organosiloxane is suitable as an adhesive or sealant for the applications in microelectronic industry.
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Xin et al. (2017) studied this question.
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