Improved “Root-Omega” Method for Transmission-Line-Based Material Property Extraction for Multilayer PCBs

Electrical properties of dielectric substrate are critical in designing high-speed products in terms of signal and power integrity. It is important to accurately characterize the dielectric properties to avoid overestimating or underestimating in the design. This paper proposes the improved “Root-Omega” method for extracting dielectric properties from fabricated multilayer printed circuit boards. Based on the electrical properties of fabricated transmission lines, the improved “Root-Omega” method applied to cases with smooth and rough conductors is validated using simulations. Error sensitivity analysis is performed to demonstrate the potential errors in the original “Root-Omega” procedure and the error sensitivity is significantly reduced by the proposed improvements.