High-performance large-inductance embedded inductors in thin array plastic packaging (TAPP) for RF system-in-package applications

We report the first demonstration of high-Q embedded inductors fabricated using a thin-array-plastic-packaging (TAPP) technology. The TAPP technology provides a platform that integrates digital, analog, RF integrated circuits, along with high-performance passive components for system-in-package implementation. Embedded inductors ranging from 14 to 300 nH were fabricated. All the inductors with inductance less than 100 nH exhibit self-resonant frequency above 1 GHz. For a 14-nH inductor, Q factor of 35 was achieved at 1.6 GHz and the self-resonance frequency was measured at 6.15 GHz.