The channel hot carrier degradation mechanisms in n-FinFET devices are studied. In long channel devices, interface degradation by hot carriers mainly degrades the device at the maximum impact ionization condition (VG~ VD/2). At higher VGcloser to VD, cold and hot carrier injection to the oxide bulk defect increases and dominates at the VG=VDstress condition. On the other hand, in short channel devices, hot carriers are generated continuously with respect to VGand highly at VG=VD, and this hot carrier injection into the oxide bulk defect is the main degradation mechanism.
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Cho et al. (2013) studied this question.
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