Polishing behavior of copper and tantalum using aqueous slurries containing alumina and silica abrasives with and without /glycine has been investigated at different pH values. It was observed that pH-dependent changes in the surface characteristics of the films being polished lead to significant variation in the copper and tantalum removal rates. Some of the surface characteristics that change with the slurry pH include the nature of the passivating layer formed on the metal surface and the hardness of such layers. It is also shown that a favorable copper to tantalum polish rate selectivity can be obtained by adjusting the slurry pH.
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Jindal et al. (2004) studied this question.
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