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Polish rates of copper and tantalum were measured using potassium iodate-based slurries containing silica abrasives for several concentrations of potassium iodate and pH. The tantalum polish rate increases rapidly with pH beyond pH 10.0 and with 3% silica reaches a value of about 215 nm/min while copper polish rate under the same conditions is only about 45 nm/min. Also, the dissolution/passivation behaviors of copper as well as tantalum were investigated by electrochemical measurements.
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Li et al. (2001) studied this question.
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