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January 1, 2008Journal of The Electrochemical SocietyOpen Access

Effect of CMP Slurry Chemistry on Copper Nanohardness

Robin Ihnfeldt Jan B. Talbot

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Abstract

Electrolytic Copper Layers Investigated byAtomic Force Microscopy M. Cerisier, C. Van Haesendonck and J.

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Cite This Study

Ihnfeldt et al. (2008) studied this question.

synapsesocial.com/papers/6ab8b5e162dd9f46e7075798 https://doi.org/10.1149/1.2903293

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Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

1Nanoindentating Mechanical Responses and Interfacial Adhesion Strength of Electrochemically Deposited Copper FilmOriginal Research · 2005 · 29 citations
2Effect of pH on CMP of Copper and TantalumOriginal Research · 2004 · 103 citations
3The Effects of Copper CMP Slurry Chemistry on the Colloidal Behavior of Alumina AbrasivesOriginal Research · 2006 · 19 citations
4Material removal mechanism in chemical mechanical polishing: theory and modelingOriginal Research · 2001 · 657 citations
5Indentation Analysis of Elastic-Plastic Homogeneous and Layered Media: Criteria for Determining the Real Material HardnessOriginal Research · 2003 · 70 citations

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