A new simulation method for MHPA: A multi-scale heat transfer parametric simulation model of heat pipes based on co-simulation

A multi-scale heat transfer parametric simulation model of heat pipes based on co-simulation (MHTPCHP) for the heat transfer performance of micro heat pipe array (MHPA) was established. This model couples the steady-state and transient numerical approaches. The steady-state model was used to quickly predict the heat transfer limit and performance of MHPA. Then, the transient model was employed to achieve more refined performance predictions. By comparing model predictions against performance experiment results, the deviation was found to be 5.43%, which verifies the feasibility of the model. The validated model was used to conduct performance tests on MHPAs with four microgroove heights and four microgroove widths. Results show that changing the height of the microgroove improves the performance of the heat pipe better than changing the width of the microgroove. At 0.6 mm height, the dryout limit in the pipe increased to 1.49 times the original. In addition, the flow pattern changes in the heat pipe with a microchannel of 6 mm × 2.2 mm and 2.1 mm × 2.2 mm were compared. Notably, no liquid slug phenomenon occurred in the heat pipe with a microchannel of 6 mm × 2.2 mm. Meanwhile, comparing the flow pattern changes under the microgroove sizes of 0.6 and 0.3 mm showed that, under a heating power of 64 W at a 3° inclination angle, the thickness of the liquid in the groove at the outlet of the evaporator section of the heat pipe at 0.6 mm was significantly greater than that at 0.3 mm. Moreover, local drying occurred in the groove at the outlet of the evaporator section of the heat pipe at 0.3 mm.