Topology optimization and heat-transfer enhancement mechanisms of microchannels based on field synergy, entransy dissipation, and entropy generation

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In response to the thermal management challenge of high heat flux density chips, this study conducts multi-objective topology optimization of microchannels, and combines the field synergy principle, entransy dissipation theory, and entropy generation analysis to construct a multidimensional performance evaluation framework. Taking heat transfer enhancement and flow drag reduction as the optimization objectives, a fluid–thermal topology optimization model is established, and a topologically optimized microchannel (TOMC) configuration with a favorable balance between thermal and hydraulic performance is selected based on the Pareto front and comprehensive thermo-hydraulic evaluation. Using a conventional straight microchannel (CSMC) and a pin-fin microchannel (PSMC) as reference models, three-dimensional conjugate heat transfer simulations and experimental validation are conducted to systematically elucidate the underlying heat transfer enhancement mechanisms. The results demonstrate that at the highest Reynolds number investigated, the TOMC pressure drop is reduced by 31.54% and 30.09% relative to the CSMC and PSMC, respectively, while the corresponding maximum temperature rise is decreased by 40.48% and 17.72%, respectively. Furthermore, field synergy, entransy dissipation, and entropy generation analyses show that the topology-optimized configuration improves the internal flow distribution and the spatial coordination between the velocity and temperature-gradient fields, reduces the dissipation of heat-transfer capability and lowers the total entropy generation, which is dominated by the thermal contribution. This research provides theoretical support and engineering guidance for the design of liquid cooling structures for high-power electronics.