Dependence of crystallographic tilt and defect distribution on mask material in epitaxial lateral overgrown GaN layers

We have investigated the dependence of crystallographic tilt and defect distribution on mask material in metalorganic chemical vapor deposition grown GaN layers formed utilizing an epitaxial lateral overgrowth (ELO) technique using x-ray diffraction and transmission electron microscopy. Crystallographic tilt in the ELO GaN layer was suppressed by changing the mask material from electron beam (EB)-evaporated SiO2 to plasma enhanced chemical vapor deposition (PECVD) grown SiO2 and PECVD SiNx. Defect distribution also changes in accordance with mask materials. By depositing a thin PECVD SiNx layer on the PECVD SiO2 mask, the crystalline quality of the ELO layer changes from that used with the SiO2 mask to that used with the SiNx mask. These results suggest that the interface between the ELO GaN layer and the mask has a significant effect on crystallographic tilt and defect distribution.