Solvent‐Based Chemical Delamination of End‐Of‐Life Photovoltaic Modules: A Systematic Review

End‐of‐life processing of crystalline‐silicon photovoltaic modules is constrained by the ethylene–vinyl acetate (EVA) encapsulant, whose strong adhesion to glass and cells limits selective material recovery and may compromise wafer integrity. This systematic review applied a PRISMA‐based protocol to Scopus and the Web of Science Core Collection for studies published between 2015 and 8 July 2026, yielding 65 peer‐reviewed studies on solvent‐based delamination. The corpus included single solvents, solvent mixtures, and intensified processes using heating, ultrasound, solvothermal treatment, and supercritical‐fluid assistance. For each study, solvent systems, sample configurations, operating conditions, intensification parameters, endpoint definitions, and quantification bases were extracted. Evidence on solvent recovery, reuse, environmental, health, safety, economic, and scale‐up aspects was also assessed. Findings were interpreted using solvent–polymer affinity and transport descriptors, including Hansen solubility parameters, cohesive‐energy considerations, wettability, viscosity, and mass‐transfer limitations. Delamination performance depended on thermodynamic affinity, operating severity, and process intensification, whereas aggressive conditions increased residue formation and damage to brittle device layers. The proposed Solvent–Kinetics–Silicon Integrity framework supports solvent screening, endpoint‐consistent comparison, and process‐window selection. Biosolvents and selected deep eutectic solvents showed promising study‐specific results, but robust cross‐family comparison requires standardized layer‐specific endpoints, residue quantification, solvent‐recovery data, wafer‐level integrity diagnostics, and comparable, reproducible, standardized operating conditions.