In situ measurement of electroless plating rates of copper onto glass substrates has been achieved. The technique employs optical absorption measurements of the depositing copper film on rotating cylindrical glass substrates which are immersed in the plating solution. The substrates have been sensitized and activated by tin and silver solutions, respectively. Effects of stirring and composition of the plating solutions on the copper deposition rates are reported. It appears that the copper deposits at an anomalous initial rate which usually decreases with time to a steady final rate. The initial and final rates behave differently with respect to composition of the plating solution. Dissolved oxygen has a significant effect in retarding the initial rate of deposition. Structural characteristics of the film produced from such solutions are also reported.
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Dumesic et al. (1974) studied this question.