Probabilistic Thermal‐Shock Strength Testing Using Infrared Imaging

This is the authors' abstract. We don't add key points for this paper.

A thermal‐shock strength‐testing technique has been developed that uses a high‐resolution, high‐temperature infrared camera to capture a specimen's surface temperature distribution at fracture. Aluminum nitride (AlN) substrates are thermally shocked to fracture to demonstrate the technique. The surface temperature distribution for each test and AlN's thermal expansion are used as input in a finite‐element model to determine the thermal‐shock strength for each specimen. An uncensored thermal‐shock strength Weibull distribution is then determined. The test and analysis algorithm show promise as a means to characterize thermal shock strength of ceramic materials.