Novel fin design and layout patterns for superior hydrothermal performance of microchannel heat sink

Efficient thermal management is essential for ensuring the reliable operation and extended lifetime of modern electronic devices, where microchannel heat sinks (MCHS) play a critical role. In this study, a novel H-shaped pin fin geometry is proposed and numerically analyzed to improve the hydro-thermal performance of MCHS. The novelty of the design lies in its increased wetted surface area and refined flow dynamics through staggered placement of fins, promoting boundary-layer disruption, interacting shear layers, and enhanced mixing, which collectively improve heat dissipation. The parametric investigation examines fin heights from 0.75 mm to 2.0 mm and thicknesses from 0.1 mm to 0.4 mm under a uniform heat flux of 150 kW m −2 and a Reynolds number of 800. Water is used as the coolant and copper as the heat sink material. Performance is assessed using base temperature (T b ), Nusselt number (Nu), pressure drop (ΔP), and the Thermal Performance Factor (TPF). Findings suggest that taller fins significantly lower the base temperature, whereas thickness variation produces a less pronounced effect. The optimal configuration is obtained for a fin height = 2 mm with a thickness = 0.2 mm, achieving TPF value of 1.19. To further enhance the hydrothermal performance, the optimal pin-fin geometry is arranged on the MCHS in nine unique staggered configurations. The maximum TPF value reaches 1.38, corresponding to a 38% improvement over the heat sink without pin fins.