Precisely characterizing the thermophysical properties of thin dielectric films, such as specific heat and thermal conductivity, is essential for the thermal design and thermal management of microelectronic devices. Nevertheless, accurately measuring the thermophysical parameters of thin dielectric films with thicknesses of only a few micrometers continues to pose significant challenges. In this paper, we propose a novel method that can simultaneously measure the multiple thermal parameters of thin dielectric films. The measurement principle is based on the analysis of the pyroelectric response current generated in the dielectric film when subjected to a thermal pulse, with this current being determined by the thermal properties of the material. An iterative fitting method is employed to extract the target thermal parameters by minimizing the difference between the simulated and the experimental current spectrum. The measurement results for several typical dielectric material samples, including polypropylene (PP), polyimide (PI), and polyethylene (PE), are highly consistent with literature data. Additionally, an analysis of the measurement uncertainty is conducted, demonstrating the feasibility and accuracy of the proposed method.
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Chen et al. (2026) studied this question.
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