Nanoimprint lithography (NIL) is a method for high throughput and relatively low cost for the fabrication of high‐resolution 3D patterns. This study focuses on replicated NIL structures with undercuts, examining critical parameters such as geometry and material properties. A two‐phase investigation was conducted: In the first phase, suitable structural geometries and structure height was analyzed for a successful replication. In the second phase, the influence of the undercut radius and stamp material was analyzed. Furthermore, finite element analysis (FEA) via COMSOL was utilized to simulate stress distribution and deformation during the lift‐off process. The findings highlight that elastic stamp materials, such as DELO PHOTOBOND VE 556992, are well‐suited for minimizing stress and preventing damage to the master and stamp. In contrast, stiffer materials like DELO KATIOBOND OM6115 perform better for larger radii but face challenges with stress build‐up at smaller radii. These results offer practical guidance for NIL stamp manufacturing with complex geometries.
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Karapatzakis et al. (2026) studied this question.
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