Advanced Thermal Management Technologies for Artificial Intelligence Data Center

Artificial-intelligence computing is changing the thermal design problem in data centers.The decisive shift is not simply higher total electricity consumption; it is the concentration of rapidly varying heat in accelerator packages, densely integrated servers, and racks that increasingly exceed the practical reach of conventional roomair systems.This review evaluates advanced air management, rear-door heat exchangers, direct-to-chip cold plates, single-and two-phase immersion, jet and spray concepts, heat pipes, warm-water loops, intelligent controls, and heat recovery.The evidence indicates that liquid cooling is moving from a specialist high-performancecomputing practice toward mainstream AI infrastructure, yet the strongest architecture is conditional on heat flux, rack density, service model, climate, water availability, coolant governance, and the useful destination of recovered heat.Direct-to-chip cooling presently offers the strongest balance of maturity, density capability, serviceability, and compatibility with warm-water heat recovery.Immersion can remove fans and accommodate exceptional volumetric densities, but fluid compatibility, maintenance practice, hardware warranties, and end-of-life management remain material barriers.