Direct‐Write 3D Printing of TIM ‐Free Heat Sinks for Enhanced Chip‐Level Thermal Management

Compared with traditional thermal interface material (TIM) systems, the TIM‐free heat dissipation system proposed in the study removes the separate TIM layer by using a 3D‐printed monolithic structure, thereby reducing the number of thermal interfaces in the heat path. The integrated design allows for custom‐designed, lightweight, and compact structures directly printed onto heat sources, enhancing thermal management efficiency. In this study, we introduce a novel silicone‐based thermal conductive gel, named TIM‐free, achieving a thermal conductivity of up to 1.69 W m −1 K −1 , a total thermal resistance as low as 5.31 × 10 −4 m 2 K W −1 , a storage modulus as low as 392.8 Pa, and an elongation at break of up to 5.44%. Moreover, the TIM‐free gel exhibits excellent printability and can be directly written into 3D heat sink structures. In thermal management tests, the TIM‐free gel was printed directly onto ceramic heaters; compared with setups without any TIM, the temperature of the ceramic heater equipped with the printed TIM‐free heat sink was reduced by 10°C. This approach is particularly suitable for high‐power‐density, next‐generation electronics requiring efficient and space‐saving thermal solutions.