Thermal behavior of banana pseudostem–wood dust hybrid particleboards bonded with phenol–formaldehyde resin

This study evaluates the thermal behavior of phenol–formaldehyde (PF)‐bonded banana pseudostem–wood dust (BPS–WD) hybrid particleboards. Boards with BPS:WD ratios of 100:0, 70:30, and 50:50 were fabricated at a target density of 0.50 g cm − 3, a nominal size of 340 mm × 340 mm × 25 mm, a fixed PF loading of 5 wt% on a dry‐particle basis, and a hot‐press temperature of 181°C. Thermogravimetric analysis (TGA) was used to compare mass‐loss behavior up to approximately 800°C and final residue, while differential scanning calorimetry (DSC) was used for comparative interpretation of the retained heat‐flow curves. All formulations showed an initial mass loss below approximately 100°C, followed by the principal lignocellulosic degradation region and slower high‐temperature decomposition. The 100:0 formulation produced the highest final residual mass (12.72%), followed by 70:30 (6.03%) and 50:50 (1.42%). The remaining residue may include both carbonaceous char and inorganic mineral ash; therefore, residual mass was not interpreted as a direct ranking of overall board quality. The DSC profiles also differed among the formulations, demonstrating that the BPS:WD ratio affected heat‐flow response. These findings establish a focused thermal comparison of PF‐bonded BPS–WD particleboards and provide a basis for future work using fully recorded quantitative thermal‐transition parameters.