What question did this study set out to answer?

To investigate how the duration of formate treatment affects the bond strength of Ag/Ag direct solid-state joints.

March 26, 2026The Proceedings of Mechanical Engineering Congress Japan0 citationsOpen Access

Effect of Formate Treatment Time on Ag/Ag Direct Solid State Bond Strength

SBShuto BABAGunma University TKTakaomi KISIMOTO SKSinji KOYAMA

Key Points

To investigate how the duration of formate treatment affects the bond strength of Ag/Ag direct solid-state joints.
Analyzed Ag/Ag bond strength over varying formate treatment durations.
Utilized lead-free solders based on Sn-Ag-Cu alloys.
Examined the influence of thermal stress on joint reliability.
Bond strength improves with optimal formate treatment duration.
Lead-free solders exhibit higher melting points and potential thermal stress issues.
Joint reliability may decrease without adequate formate treatment time.

Abstract

In response to global environmental concerns and regulations such as the RoHS directive enforced by the EU since July 2006, the electronics industry has advanced toward more environmentally friendly manufacturing. In particular, lead-free solders based on Sn-Ag-Cu alloys are widely used to eliminate toxic lead (Pb). However, high-lead solders containing more than 85% Pb (e.g., Pb-5Sn, Pb-10Sn) remain in use for power semiconductor devices requiring high thermal resistance, due to exemptions under current RoHS regulations. Lead-free solders, while safer, have higher melting points, which can raise bonding temperatures and cause thermal stress, reducing joint reliability.

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