China Electronic Product Reliability and Environmental Test Institute

Recent papers from China Electronic Product Reliability and Environmental Test Institute

1. Temperature-dependent electrical performance of β-Ga2O3 Schottky barrier diodes under 5 MeV proton irradiationMaterials Science in Semiconductor Processing · 2026
2. Implications of aging through HV-H3TRB on the repetitive avalanche mode ruggedness of 1.2 kV SiC MOSFETsMicroelectronics Reliability · 2026
3. Defect Engineering in β -Ga2O3 Schottky Barrier Diodes via Proton Irradiation and Subsequent Low-Temperature Supercritical Fluid TreatmentACS Applied Materials & Interfaces · 2026
4. Self‐Powered MXene/a‐Ga 2 O 3 Schottky Solar‐Blind UV Photodetector for UV Imaging and Optical CommunicationAdvanced Optical Materials · 2026
5. A simulation of fin structures thermal design for high-power integrated circuit dynamic burn-in testMicroelectronics Reliability · 2026
6. Molecular dynamics study of Co/Co interfacial diffusion for low-temperature hybrid bonding: Effects of orientation and surface roughnessMaterials Science in Semiconductor Processing · 2026
7. Application of Porous Copper-Based Interconnect Materials in Electronic Packaging: A Brief ReviewMaterials · 2026
8. Constellation reshaping via nonlinear wave mixing for reconfigurable QAM channel manipulationOptics & Laser Technology · 2026
9. Radiation effects of heavy ions in hydrogen-terminated diamond field-effect transistorsApplied Physics Letters · 2026
10. Analytical stiffness evolution of involute spline couplings with gap-dependent tooth engagement under combined errorsProceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science · 2026
11. A hybrid approach for predicting corporate financial distress: Integrating Complex network features and machine learning modelJournal of Intelligent & Fuzzy Systems · 2026
12. Trace Phosphorus-Modified Hot-Dip Sn Coatings on Cu Substrates: Surface Film Formation and Corrosion Resistance in NaCl SolutionCoatings · 2026
13. Multi-view multi-dimensional collaborative completion for node classification with missing attributesComplex & Intelligent Systems · 2026
14. Research on the protrusion behavior and evolution mechanism of TSV in 3D packaging under high temperatureSoldering and Surface Mount Technology · 2026
15. Metal Surface Current Density Fast Imaging via a Hx and Hy Simultaneous Near‐Field Probing SystemMicrowave and Optical Technology Letters · 2026
16. Investigation on the Cumulative Degradation in p-GaN Gate HEMTs Under Synergistic Electrical Stress and Heavy Ion IrradiationIEEE Transactions on Electron Devices · 2026
17. Descriptor-driven UMAP (D-UMAP) for visualizing and analyzing structural evolution in SiC nano-grindingJournal of Applied Physics · 2026
18. Adaptive Iterative Learning Control for Uncertain MIMO Systems with Application on Underwater Robot Trajectory TrackingMathematics · 2026
19. Single and Repetitive Surge Reliability of 1200 V Asymmetric Trench SiC MOSFETs Under Various Gate BiasesMicromachines · 2026
20. Porosity morphology in laser-based thermal joining of steel/thermoplastic and steel/composite joints characterized by X-ray computed tomographyProceedings of the Institution of Mechanical Engineers Part L Journal of Materials Design and Applications · 2026