Electronic textiles (e-textiles) offer promising capabilities in communication, energy storage, safety, comfort, and sensing. A key requirement for e-textiles is the development of conductive patterns with high design flexibility, high electrical conductivity, and strong adhesion to the textile substrates. In this study, a simple approach combining laser-induced forward transfer (LIFT) and electroless copper (Cu) deposition to create high-resolution, highly conductive patterns on textiles is presented. LIFT is used to deposit microsized silver (Ag) seeds onto textiles, offering significant design flexibility for conductive patterns due to the precise control provided by the automated laser system. The silver seeds act as catalysts for subsequent electroless Cu deposition, leading to localized continuous copper tracks with high conductivity. An appropriate spatial distribution of the Ag particles is essential for achieving uniform copper deposition. This was attained through an appropriate design of the donor for the LIFT process. To enhance the adhesion of the Cu coating to the textile, a siloxane-based intermediate layer was introduced between the textile and silver seeds, which significantly improved the adhesion of the copper deposits. As a proof of concept, the methodology was employed for the preparation of inductive antennas on textiles. The combination of LIFT and electroless deposition demonstrates an effective approach for the production of e-textiles.
Domke et al. (Fri,) studied this question.