Demonstrates durable conductivity in textile electronics, indicating a cost-effective solution.
This study reports a cost-effective and scalable strategy for fabricating silver-coated copper (Ag/Cu) powders intended for conductive-textile applications. By optimising pre-treatment, mechanical polishing and electroless silver-plating parameters, the Ag/Cu powders achieved a remarkably low resistivity of 1.8 × 10-6 Ωm and excellent adhesion to a range of textile substrates. The formulated conductive ink, based on Ag/Cu powders and a flexible resin binder, performed reliably on both natural and synthetic fibres. Wash testing (AATCC 135) showed that the sheet resistance rose from 2.0 Ω sq-1 to ≈ 3.2 Ω sq-1―about a 60 % increase―after 30 domestic cycles, yet remained well below the 5 Ω sq-1 limit typically required for textile sensors, confirming durable conductivity under laundering. These results highlight Ag/Cu-based fibre composites as a practical, lower-cost alternative to silver-only inks for flexible and wearable electronic systems.
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Guo et al. (2026) studied this question.
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