Analytical model reveals electro-elastic behavior in graded piezoelectric structures under uniform load, suggesting new insights for sensor design.
Functional gradient piezoelectric strucues have become an essential components in intelligent sensing applications due to their unique electromechanical coupling properties. However, the multifield coupling and material gradients present analytical challenges in determining the electromechanical response in these structures. Therefore, this paper presents an analytical model to analyze the electro-elastic field in a heterogeneous circular plate subjected to a uniformly distributed load on the lower boundary. Direct displacement method is employed to derive the coupling electro-elastic field so as to get the explicit expression of stress and displacement. Based on the proposed model, numerical calculations are performed to validate the present analysis and to investigate the influence of the material heterogeneity and the multifield coupling. The proposed analytic model provides novel insights into efficient calculations for the design and optimization of intelligent sensors.
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Liu et al. (2025) studied this question.
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