Experimental analysis reveals thermal conductivity trends in AlxGa1−xN thin films, highlighting mass-disorder effects.
AlxGa1−xN with a high Al composition (x) presents significant potential for advancing next-generation high-power electronic devices. To support the thermal design of AlxGa1−xN-based electronics, the thermal conductivity of AlxGa1−xN thin films was measured as a function of Al composition, temperature, and film thickness using time-domain thermoreflectance and frequency-domain thermoreflectance techniques. The measurement results were interpreted by modeling phonon transport in AlxGa1−xN films using the phonon Boltzmann transport equation. Phonon properties, including frequencies, group velocities, and lifetimes, were calculated using a virtual crystal approximation, with the effects of mass-disorder scattering incorporated via the Tamura model. The measured thermal conductivity of Al0.7Ga0.3N is an order of magnitude lower than those for GaN and AlN, exhibits an increase followed by saturation with temperature, and shows a modest decrease with a reduction in the film thickness. The modeling results agree with the measurement results and reveal that mass-disorder scattering and phonon-boundary scattering are the dominant mechanisms that reduce the thermal conductivity of AlxGa1−xN thin films.
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Kang et al. (2025) studied this question.
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