P‐78: Optimization Scheme for Bending Process of Display Module Based on Simulation

The narrow bezel design is a strong demand for full‐screen smartphones, where the width of the bottom bezel is limited by the radius (R0) of the Flexible Printed Circuit (FPC) after bending and the process capability of the FPC bending technology. Reducing the radius (R0) and adjusting the bending process parameters can decrease the size of the bottom border. But small R0 will increase the strain in the bending area, significantly raise the risk of metal cracks. This paper introduces a risk assessment and process optimization scheme of bending process. Based on simulation, optimizing the bending process to reduce the strain of the metal layer. Evaluating the impact of process accuracy. Comparing the differences of bending process between 2D and 3D curve cover glass (CG). Providing optimization directions for the design of deep‐curve narrow bezel to reduce the defect rate and reliability risks.