Study on the Optimization of the Morphology and Nucleation Mechanism of Electroplated Sn-Pb Coatings by the Synergistic Effect of Composite Additives

This study investigates the synergistic effects of single- and binary-additive systems on the morphology and nucleation mechanism of Sn-Pb alloy electrodeposited coatings. Scanning electron microscopy (SEM), energy-dispersive spectroscopy (EDS), linear sweep voltammetry (LSV), electrochemical impedance spectroscopy (EIS), and chronoamperometry were applied in order to obtain more information on the action mechanisms of single-additive systems (cinnamaldehyde, PEG-2000, gelatin, vanillin) and binary ones (0.1 g/L cinnamaldehyde + 0.2 g/L PEG-2000) in Sn-Pb electroplating. Results showed that the use of binary-additive systems based on cinnamaldehyde and PEG-2000 significantly improved coating quality, leading to a smooth and uniform surface, dense grains, and a near-eutectic composition (Sn 63.10 wt.%, Pb 36.90 wt.%). This was because the composite additive, through synergistic effects, exhibited the highest cathodic polarization and the largest charge transfer resistance (189.20 Ω cm2), thus inhibiting the electrodeposition process of Sn2+ and Pb2+. Chronoamperometry revealed that, unlike single additives (PEG-2000 or cinnamaldehyde), the binary-additive system promoted a transition of nucleation mode to instantaneous nucleation, accompanied by a decrease in the peak current and an extension of the corresponding time. This study provides a theoretical basis and experimental support for understanding the nucleation mode of Sn-Pb electroplating, as well as optimizing the synergistic mechanism of additives.