A Novel Matching Technique for Microstrip Feeds usingOptimized Tapering

This paper presents an efficient impedance matching technique for microstrip feed structures, providing a practical solution for seamless connector integration in high-frequency systems. Unlike conventional approaches that assume predefined connector compatibility, this method allows adaptation to various connector constraints without requiring major structural modifications. A linearly tapered microstrip feed with tapered substrate is proposed to ensure stable impedance matching, reduce signal reflection, and enhance overall system performance. The technique is demonstrated on a fabricated substrate-integrated waveguide antenna, utilizing a Rogers RT/Duroid 5880 substrate configured for 50 Ω impedance and adapted for integration with a specific coaxial connector. Experimental validation confirms excellent agreement between simulated and measured results, verifying its effectiveness in achieving impedance matching, minimizing return loss, and ensuring seamless integration with the connector while preserving radiation characteristics. This work presents a versatile feed design approach that addresses a key challenge in RF and microwave engineering, paving the way for improved performance and broader applicability in advanced communication systems and integrated circuit applications.