Inverse Lithography Technology (ILT) Under Chip Manufacture Context

With the continuous scaling of semiconductor process nodes toward 3 nm and beyond, traditional optical proximity correction and resolution enhancement technologies are increasingly challenged by the physical limits of sub-wavelength lithography. Inverse lithography technology, as a core branch of computational lithography, has emerged as a pivotal solution to break through these constraints. This review focuses on inverse lithography technology in integrated circuit manufacturing. It begins with an introduction to the key position of lithography and the background of inverse lithography. Then, it elaborates on the working principle, research progress, technical advantages, challenges, and future development directions of inverse lithography technology. By integrating relevant research findings, this paper provides a comprehensive understanding of inverse lithography technology, aiming to offer valuable insights for further research and application in this field.