This analysis shows that diode designs on SmartSiC exhibit improved current conduction, indicating substrate impacts.
In this work, we investigate the static electrical parameters of 1200 V 4H-SiC power diodes with various designs and architectures (Schottky, PiN, and JBS with hexagonal or stripes anode), fabricated on two types of 150 mm substrates (single crystal 4H-SiC reference and 3C-poly silicon carbide based substrates: SmartSiC TM ). I(V) measurements are carried out in both reverse and forward modes to assess the impact of designs and substrates. Non-destructive avalanche mode is reached with similar performance (leakage, V AV ) observed for both substrates (due to identical drift layers and device structures). All diode designs on SmartSiC TM exhibit a larger current conduction and less resistance in the ohmic regime (compared to bulk), whatever the temperature (up to 200°C). Partitioning model is also proposed for evaluating the substrate contribution on the measured specific resistance and on the observed SmartSiC TM gains.
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Abbas et al. (2025) studied this question.
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