Study on diamond/aluminum composites packaging material applied to microwave power components

With the development of high-power electronic equipment, the heat flux of microwave power components increases sharply, becoming one of the bottlenecks restricting the development of high-power electronic equipment. The selection of packaging materials for high thermal conductivity is a key to solving the heat dissipation problem of microwave power components with high heat flux. This paper investigates the application of a diamond/aluminum composite packaging material in microwave power components through a combined approach of experimental testing and numerical simulation. Experimental results show that a novel microwave power component designed with diamond/aluminum packaging material has an advantage in heat dissipation over the current silicon/aluminum packaging component. Under the heat condition of 10–50 W per chip, the temperature difference between the chip and the coolant is reduced by 22.2%–24.4%, and the enhancement in the heat transfer capability is unrelated to the substrate area when the substrate area far exceeds the heat source area. Based on thermal simulation results, the thickness of the diamond/aluminum packaging substrate has a significant impact on component heat dissipation. For each chip with heat dissipation ranging from 10 to 50 W, the optimized thickness of the diamond/aluminum packaging substrate is 2.1 mm.