This study demonstrates enhanced thermal conductivity and latent heat in phase change materials, indicating a new method for electronics cooling.
Developing advanced phase change materials (PCMs) with simultaneously enhanced thermal conductivity and preserved large latent heat is critical for efficient thermal management of electronics, enabling rapid heat harvesting within narrow temperature windows. Incorporating prefabricated high‐thermal‐conductivity frameworks into organic PCM matrices represents the most promising strategy to boost heat transfer while retaining intrinsic energy storage capacity. However, conventional casting methods face fundamental limitations: strong interlayer interactions and gravity‐induced densification hinder the construction of controllable nanosheet frameworks. Herein, a solvent‐surface‐tension‐regulated approach is proposed to fabricate hierarchically aligned graphene frameworks. The resulting eicosane‐based composite achieves an exceptional in‐plane thermal conductivity of 71.6 W m −1 K −1 at 27.8 vol.% graphene loading while maintaining a high latent heat of 123.8 J g −1 . Capillary channels within the oriented framework simultaneously enhance eicosane absorption capability from release. Through infrared thermography, finite element simulations, and performance benchmarking, superior thermal conduction and phase transition kinetics are validated. This work establishes a new paradigm for constructing orientation‐controlled thermal‐conductive networks, advancing next‐generation PCM composites in thermal management for high‐power electronics.
No takes yet. Share an insight, caveat, or question.
Chen et al. (2025) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: