Advancements in Precursors, Materials, Deposition Techniques for Thin Film Research in Electronic Devices: A Mini Review

The rise of two-dimensional (2D) materials such as graphene, transition metal dichalcogenides (TMDs), and hexagonal boron nitride (h-BN) has opened new pathways for flexible and wearable electronic devices. However, large-area, scalable, and defect-free deposition of 2D thin films remains a critical challenge for their practical integration. In this mini-review, we focus on emerging deposition methods for 2D materials in flexible electronics, including chemical vapor deposition (CVD), atomic layer deposition (ALD), molecular beam epitaxy (MBE), solution-based methods, and printing approaches. We provide a comparative assessment of cost, scalability, film quality, and compatibility with flexible substrates, highlighting both the promise and limitations of current approaches. We also discuss controversies, such as trade-offs between scalability and performance, and identify gaps where current deposition strategies fail. Finally, perspectives on future research directions are presented, emphasizing hybrid deposition approaches and environmentally benign processing routes.