Dielectric Material and Thermal Optimization in Sidewall Spacer Design for Junctionless Nanosheet FETs at sub- 5 nm Technology Node: An Insight into Device and Circuit Performance

This study focuses on the design and analysis of Junctionless (JL) NSFETs, with an emphasis on the influence of spacer materials and temperature variations. A different number of materials such as Air, SiO2, Si3N4, HfO2, and TiO2 are examined for sidewall spacer compatibility in the JL-NSFET. The same materials are used for dual material spacers with combinations of: Air+HfO2, Air+TiO2, SiO2+HfO2, and SiO2+TiO2. The investigations revealed that the usage of TiO2 material gives better digital and analog performance with reduced leakage currents and subthreshold swing (SS), higher on/off ratio, voltage gain of ~79.7 dB. Exploring the dual-k spacers produced better analog performance, gate control and reduced leakages for SiO2+TiO2 owing to the usage of higher dielectric material towards the gate. Further, the reduction of temperature from 400 K to 250 K for all the single-k and dual-k spacer materials revealed that the designed JL-NSFET is a suitable candidate at lower temperatures to improve the digital and analog performance whereas not recommended for RF performance improvement. Moreover, the SiO2+HfO2 spacer-based CMOS inverter is noticed to have better gain (~15V/V), noise margin, and lower delays (~5.1 ps) when compared to TiO2 spacer-based complementary metal oxide semiconductor inverter making it suitable for digital IC applications.