Piezo resistivity of B- and P-doped epitaxial Si 1-x Ge x (x=10-30%) is investigated to assess its application potential for thin film strain sensors. The gauge factor (GF) is calculated based on the change in resistivity to the externally induced compressive uniaxial strain along the current flow direction. In the case of B-doped SiGe, the resistivity decreases under the induced compressive strain which may be related to hole mobility enhancement, while no influence on the resistivity of the P-doped SiGe. A significant increase in the GF is observed by lowering B concentration. At the same B concentration, slightly higher GF is observed for higher Ge content. Moreover, the GF is slightly improved by lowering the SiGe growth temperature. The slight improvement may be related to improved crystallinity. These results suggest that the low-doped p-type SiGe deposited at low temperature has reasonable GF and can potentially be applied in strain sensors.
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Yamamoto et al. (2024) studied this question.
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