Synapse
⌘+K
Synapse
PulseExploreJournal ClubResearchersJournals
Instagram
HomeJournal ClubExplore
August 9, 2024Meeting abstracts/Meeting abstracts (Electrochemical Society. CD-ROM)

Next Generation Heterogeneous 3D IC Chip Packaging

View Full Paper
Ask AI
Bookmark
Share

Authors

AWAlvin WinataCLChia Kai LinVKVishal Mani Kalaimani

Discussion

Loading...

Member takes

Overview

Key Points

Key points are not available for this paper at this time.

Cite This Study

Winata et al. (2024) studied this question.

synapsesocial.com/papers/68e5cebeb6db6435875659d9https://doi.org/10.1149/ma2024-01331649mtgabs
View Full Paper
Ask AI
Bookmark
Share

Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Current Advances and Outlook of Advanced Packaging2025 · 6 citations
  2. 2Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packaging2024 · 1 citations
  3. 3Solutions enabling advanced packaging and heterogeneous integration2024
  4. 43.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators2024 · 33 citations
  5. 5Design and Architecture Definition for Advanced 3D Fan-Out Wafer-Level Packaging2024 · 4 citations