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September 30, 2024Journal of Microelectronics and Electronic PackagingOpen Access

Design and Architecture Definition for Advanced 3D Fan-Out Wafer-Level Packaging

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KBKaran BhangaonkarSSSantosh Sankarasubramanian

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Bhangaonkar et al. (2024) studied this question.

synapsesocial.com/papers/68e56f73b6db64358750fe06https://doi.org/10.4071/001c.124087
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