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April 10, 2024

Lithography related challenges within advanced packaging

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AMAndy MillerUniversity of Maryland, College Park

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Cite This Study

Andy Miller (2024) studied this question.

synapsesocial.com/papers/68e6fb90b6db6435876761cfhttps://doi.org/10.1117/12.3011421
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Also Consider

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  1. 1New ecosystems of metrology, inspection and test are needed for advanced packaging heterogenous integration2024
  2. 2Solutions enabling advanced packaging and heterogeneous integration2024 · 2 citations
  3. 3Full field lithography as an answer to heterogeneous packaging challenges2025
  4. 4Addressing Die Displacement in Lithography Processes for Advanced Packaging Applications2024
  5. 5Transcending the Reticle Limit in On-Wafer Die Integration and Advanced Packaging: Full-Wafer Patterning with High-Productivity Electron Beam Lithography2024