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February 29, 2024IMAPSource ProceedingsOpen Access

Addressing Die Displacement in Lithography Processes for Advanced Packaging Applications

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Authors

SMSylvain I. MisatJBJeroen de BoeijKulicke & Soffa (United States)CHChia-Ching HuangNational Taiwan University

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Misat et al. (2024) studied this question.

synapsesocial.com/papers/68e76f9cb6db6435876e533fhttps://doi.org/10.4071/001c.94485
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Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Lithography related challenges within advanced packaging2024
  2. 2Transcending the Reticle Limit in On-Wafer Die Integration and Advanced Packaging: Full-Wafer Patterning with High-Productivity Electron Beam Lithography2024
  3. 3Solutions enabling advanced packaging and heterogeneous integration2024 · 2 citations
  4. 4Addressing Advanced IC Substrate Deformation and Pattern Distortion using an Extremely Large Exposure Field Fine-Resolution Lithography System2024
  5. 5Full field lithography as an answer to heterogeneous packaging challenges2025