Fabrication of 3D Metallic Mesostructures In article number 2300827, Paul V. Braun and co-workers discover the transformative power of nanostructured copper oxide (nCO) coatings in enhancing cooling efficiency. Electrochemically reducible, the nCO coatings enable intricate interference lithography process on reflective semiconductor substrates, fostering electrodeposition of mesostructured metals. These mesostructured coatings provide 3× heat flux and 2× heat transfer coefficient improvements over conventional systems, with a particular impact on power electronics cooling. [Image created by Gaurav Singhal and Alex Jerez Roman.]
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